![Apple to Split Enterprise and Western Europe Roles as VP Exits [Report]](https://www.iclarified.com/images/news/97032/97032/97032-640.jpg)
![Nanoleaf Announces New Pegboard Desk Dock With Dual-Sided Lighting [Video]](https://www.iclarified.com/images/news/97030/97030/97030-640.jpg)
![Apple's Foldable iPhone May Cost Between $2100 and $2300 [Rumor]](https://www.iclarified.com/images/news/97028/97028/97028-640.jpg)
![Alleged Pixel 10 series wallpapers leak with vibrant colors and a strange new theme [Gallery]](https://i0.wp.com/9to5google.com/wp-content/uploads/sites/4/2025/04/pixel-10-wallpaper-leak-1.jpg?resize=1200%2C628&quality=82&strip=all&ssl=1){kind=tracking}
![CVE security program used by Apple and others has funding removed [U]](https://i0.wp.com/9to5mac.com/wp-content/uploads/sites/6/2025/04/CVE-security-program-used-by-Apple-and-others-under-immediate-threat.jpg?resize=1200%2C628&quality=82&strip=all&ssl=1)
.webp?#)
![[The AI Show Episode 144]: ChatGPT’s New Memory, Shopify CEO’s Leaked “AI First” Memo, Google Cloud Next Releases, o3 and o4-mini Coming Soon & Llama 4’s Rocky Launch](https://www.marketingaiinstitute.com/hubfs/ep%20144%20cover.png)
.jpg?#)
Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as "panel-level", to meet rising demand for powerful AI chips (Cheng Ting-Fang/Nikkei Asia)
Cheng Ting-Fang / Nikkei Asia: Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as “panel-level”, to meet rising demand for powerful AI chips — TAIPEI — Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach …
Cheng Ting-Fang / Nikkei Asia:
Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as “panel-level”, to meet rising demand for powerful AI chips — TAIPEI — Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach …
